ProMOS, Lin Packaging Reach Accord In Patent Suit

Law360, New York (September 19, 2008, 12:00 AM EDT) -- Lin Packaging Technologies Ltd. has struck a settlement deal with Taiwanese dynamic random access memory chip-maker ProMOS Technologies Inc. in a patent suit Lin Packaging brought against ProMOS and one other defendant in February.

Attorneys for Lin Packaging and ProMOS signed off on a joint motion on Thursday, asking Judge David Folsom of the U.S. District Court for the Eastern District of Texas to dismiss ProMOS from the case with prejudice because the parties had settled.

Lin Packaging lodged the case on Feb. 20, 2008, naming...
To view the full article, register now.