Lin, Powerchip Resolve Patent Suit Over SDRAM

Law360, New York (August 31, 2009, 12:43 PM EDT) -- Lin Packaging Technologies Ltd. has reached a settlement with Powerchip Semiconductor Corp. in a suit accusing Powerchip and another defendant of infringing a patent covering computer chip technology.

Attorneys for Lin Packaging and Powerchip signed off on a joint motion Friday asking Judge David Folsom of the U.S. District Court for the Eastern District of Texas to dismiss Powerchip from the case without prejudice.

Further details were not immediately available, and representatives for Lin Packaging and Powerchip could not immediately be reached for comment.

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