Amkor sues Malaysia's Carsem at ITC Over Chip Technology

Law360, New York (November 17, 2003, 12:00 AM EST) -- Amkor Technology Inc. has filed suit against Carsem Semiconductor and its parent company Carsem, a rival semiconductor assembly and test services provider based in Malaysia, for infringing several of Amkor's patents related to its MicroLead frame package.

The suit, filed at the International Trade Commission in Washington, alleges that Carsem's manufacture and sale of its dual and quad flat no lead packages in the U.S. infringes on Amkor's United States Patent Nos. 6,433,277, 6,455,356, and 6,630,728.

"Amkor has invested heavily in research and development for semiconductor...
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