Bonding With Teeth At The ITC

Law360, New York (October 15, 2012, 3:45 PM EDT) -- A rarely used regulation was recently brought into focus at the U.S. International Trade Commission in the case of Certain Semiconductor Chips With Minimized Chip Package Size, ITC Inv. No. 337-TA-605 (Semiconductor Chips) — an action brought by Tessera Inc. alleging patent infringement by importers of semiconductor devices. There, after the exhaustion of all appeals by respondents, the presiding judge considered the application of 19 C.F.R. § 210.50 and clarified how the bonds posted by the respondents, pursuant to the ITC’s remedial orders, should be forfeited...
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