Samsung, Hynix Targeted In Semiconductor Suit

Law360, New York (December 9, 2005, 12:00 AM EST) -- Samsung Electronics Co. and Hynix Semiconductor Inc., both competitors in the semiconductor industry, have been sued in federal court over two chip technology patents.

The complaint was filed by Texas-based Lin Packaging Technologies Ltd. in U.S. District Court for the Eastern District of Texas.

With the lawsuit, Lin Packaging is seeking an injunction against the companies, both based in Korea. Their various U.S. subsidiaries are also named in the suit.

The patents in the case were issued in 1999 and 2001 to inventor Paul T. Lin...
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