ITC to Hear Amkor's Infringement Case Vs. Carsem

Law360, New York (December 18, 2003, 12:00 AM EST) -- The U.S. International Trade Commission voted to investigate a complaint brought by chip equipment maker Amkor against Malaysian rival Carsem, Amkor said.

The complaint, filed on November 18, 2003, alleges infringement of three Amkor patents relating to its MicroLeadFrame packaging technology (U.S. Patent Nos. 6,433,277, 6,455,356, and 6,630,728).

Amkor alleges that by making, using, selling, offering for sale or importing into the United States of Carsem's dual and quad-flat no-lead package, the defendants infringed one or more of the MLF packaging technology claims in Amkor's patents....
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