Micron Will Pay $30M To Settle Patent Claims

Law360, New York (July 21, 2006, 12:00 AM EDT) -- Chip maker Micron Technologies Inc. is shelling out $30 million to settle a patent dispute with rival Tessera Technologies Inc., which accused the company of infringing its technology for semiconductor packaging.

Tessera filed the lawsuit in March 2005, in the U.S. District Court for the Eastern District of Texas. The suit, which also names Munich, Germany-based Infineon Technologies AG, was later amended to include antitrust claims.

The patent infringement charges allege that Boise, Idaho-based Micron produced semiconductor packaging components using Tessera patented inventions. Micron countersued three...
To view the full article, register now.