Law360, New York (November 02, 2009, 1:40 PM ET) -- In a case on remand from the U.S. International Trade Commission, an administrative law judge has reaffirmed a prior ruling that Carsem Sdn Bhd infringed a patent owned by semiconductor packaging company Amkor Technology Inc.
In an order issued Friday, Judge Charles E. Bullock stood by a 2005 ruling finding a violation of certain claims related to Arizona-based Amkor's MicroLead frame package described in its U.S. Patent Number 6,433,277.
The judge also reaffirmed that no violation had occurred in two other patents-in-suit related to the packaging...
ALJ Reaffirms Carsem Infringement In Amkor 337 Suit
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