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Amkor Technology, Inc. v. Carsem (M) Sdn Bhd et al
Case Number:
3:03-cv-05116
Court:
Nature of Suit:
Judge:
Firms
Companies
Sectors & Industries:
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April 04, 2005
ITC Orders New Claim Construction In Amkor's Patent Dispute With Carsem
The U.S. International Trade Commission has ordered new claims construction on patent claim terms relating to Amkor's package technology in the company’s litigation against Malay rival Carsem.
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November 19, 2004
ITC Clears Carsem In Chip Packaging Dispute With Amkor
In a preliminary decision, the U.S. International Trade Commission has cleared semiconductor packaging company Carsem of infringing patents held by rival Amkor Technology, Inc.