Try our Advanced Search for more refined results
- Law360
- Law360 UK
- Law360 Pulse
- Law360 Employment Authority
- Law360 Tax Authority
- Law360 Insurance Authority
- Law360 Real Estate Authority
- Law360 Healthcare Authority
- Law360 Bankruptcy Authority
- Products
- Lexis®
- Law360 In-Depth
- Law360 Podcasts
- Rankings
- Leaderboard Analytics
- Regional Powerhouses
- Law360's MVPs
- Women in Law Report
- Law360 400
- Diversity Snapshot
- Practice Groups of the Year
- Rising Stars
- Titans of the Plaintiffs Bar
- Sections
- Adv. Search & Platform Tools
- About all sections
- Browse all sections
- Banking
- Bankruptcy
- Class Action
- Competition
- Employment
- Energy
- Expert Analysis
- Insurance
- Intellectual Property
- Product Liability
- Securities
- Beta Tools
- Track docs
- Track attorneys
- Track judges
Amkor Technology, Inc. v. Carsem (M) Sdn Bhd et al
Case Number:
3:03-cv-05116
Court:
Nature of Suit:
Judge:
Firms
Companies
Sectors & Industries:
-
April 04, 2005
ITC Orders New Claim Construction In Amkor's Patent Dispute With Carsem
The U.S. International Trade Commission has ordered new claims construction on patent claim terms relating to Amkor's package technology in the company’s litigation against Malay rival Carsem.
-
November 19, 2004
ITC Clears Carsem In Chip Packaging Dispute With Amkor
In a preliminary decision, the U.S. International Trade Commission has cleared semiconductor packaging company Carsem of infringing patents held by rival Amkor Technology, Inc.