Amkor sues Malaysia's Carsem at ITC Over Chip Technology
The suit, filed at the International Trade Commission in Washington, alleges that Carsem's manufacture and sale of its dual and quad flat no lead packages in the U.S. infringes on Amkor's United States Patent Nos. 6,433,277, 6,455,356, and 6,630,728.
"Amkor has invested heavily in research and development for semiconductor...
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