Applica, Tilia Settle Suit Over Vacuum Sealing Technology

Law360, New York (April 10, 2004, 12:00 AM EDT) -- Electronics makers Applica and Tilia have settled their litigation over patents for vacuum sealing in a deal under which Applica will pay royalties to use Tilia’s technology.

The two companies said they had entered a licensing and settlement agreement to resolve patent infringement litigation pending in in the U.S. District Court for the Northern District of California and before the U.S. International Trade Commission in Washington, D.C.

Alica agreed to not contest the validity of Tilia's previously disputed patents and to settle any future disputes over...
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