ITC Clears Carsem In Chip Packaging Dispute With Amkor
Arizona-based Amkor’s complaint accused Carsem of infringing a total of 21 claims of Amkor’s U.S. Patent Nos. 6,433,277, 6,455,356, and 6,630,728 by making, using, selling, offering for sale, and importing into the U.S. Carsem’s Micro Leadframe Package products.
Administrative Law Judge Charles E. Bullock determined that Amkor’s asserted claims were invalid, not infringed or both, and that no violation of Section 337...
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