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ITC Clears Carsem In Chip Packaging Dispute With Amkor

Law360 (November 19, 2004, 12:00 AM EST) -- In a preliminary decision, the U.S. International Trade Commission has cleared semiconductor packaging company Carsem of infringing patents held by rival Amkor Technology, Inc.

Arizona-based Amkor’s complaint accused Carsem of infringing a total of 21 claims of Amkor’s U.S. Patent Nos. 6,433,277, 6,455,356, and 6,630,728 by making, using, selling, offering for sale, and importing into the U.S. Carsem’s Micro Leadframe Package products.

Administrative Law Judge Charles E. Bullock determined that Amkor’s asserted claims were invalid, not infringed or both, and that no violation of Section 337...
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