NYU, Autodesk Patent Dispute Reopened

Law360, New York (August 2, 2007, 12:00 AM EDT) -- Two weeks after a judge dismissed a patent suit brought by New York University against software company Autodesk Inc., the case has been reopened to consider Autodesk’s counterclaims of inequitable conduct against NYU.

In an order filed in the U.S. District Court for the Southern District of New York on Tuesday, Judge Jed S. Rakoff reopened the case, at the request of both parties, in order to conduct a bench trial to rule on Autodesk’s counterclaim that NYU’s two patents-in-suit are invalid because of inequitable conduct....
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