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Fed. Circ. Allows Tessera ITC Patent Case To Proceed

Law360 (August 4, 2008, 12:00 AM EDT) -- A federal appeals court panel has decided not to re-stay a case brought by Tessera Technologies Inc. against Motorola Inc., Qualcomm Inc., Freescale Semiconductor Inc. and others for allegedly infringing its chip-packaging patents.

Freescale had petitioned the U.S. Court of Appeals for the Federal Circuit for a writ of mandamus, which, if granted, would have stayed the case before the U.S. International Trade Commission pending re-examination of the patents at issue.

But in an opinion filed Friday, the Federal Circuit rejected Freescale's plea.

“The remedy of...
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