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Motorola, Chip Makers Face "Battle-Tested" Patents

Law360 (April 18, 2007, 12:00 AM EDT) -- Cellular phone maker Motorola Inc. and several of its chip makers, including Qualcomm Inc., face a lawsuit and possible federal investigation regarding alleged infringement of “battle-tested” computer chip packaging patents.

Chip packaging maker Tessera Inc. filed a complaint with the U.S. International Trade Commission Tuesday requesting an investigation into Motorola, Qualcomm and other chip makers. The San Jose, Calif.-based semiconductor packaging developer claims the companies infringed two patents for packages that serve as the electrical interface for semiconductor chips and protect the chips from damage....
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